Electrical Interconnection by Means of Conductive Adhesives and Inks

The research aims at developing electrical interconnection technologies for the microelectronics industry. On the one hand, a substrate is needed with a conductive pattern. Currently, this is mostly done by an etching technology, which means a lot of expensive metal is wasted. In this sense an additive alternative would be attractive, which is why I’m looking into the possibilities of printing techniques, including inkjet-, flexographic, gravure and offsetprinting. It would be convenient to use standard printers, considering the widespread use and therefore the available expertise in the conventional printing industry. On the other hand, components need to be interconnected to the patterned substrate. This assembly is usually done by soldering, but for various reasons it would be beneficial to use conductive adhesives. Several techniques are to be considered, including a technique patented at the research lab. The focus is on fine-pitch interconnection and the use of flexible substrates. Keywords—electronics, interconnection, printing, flexible